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TVS Diode Array For ESD and Latch-Up Protection
PROTECTION PRODUCTS Description
The SMS series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD and other voltage-induced transient events. Each device will protect up to four lines. They are available with operating voltages of 5V, 12V, 15V and 24V. They are unidirectional devices and may be used on lines where the signal polarities are above ground. TVS diodes are solid-state devices designed specifically for transient suppression. They feature large crosssectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage and no device degradation. The SMS series devices may be used to meet the immunity requirements of IEC 61000-4-2, level 4. The low cost SOT23-6L package makes them ideal for use in portable electronics such as cell phones, PDA's, and notebook computers.
SMS05 through SMS24
Features
Transient protection for data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 24A (8/20s) Small package for use in portable electronics Protects four I/O lines Working voltages: 5V, 12V, 15V and 24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology
Mechanical Characteristics
EIAJ SOT23-6L package Molding compound flammability rating: UL 94V-0 Marking : Marking Code Packaging : Tape and Reel per EIA 481
Applications
Cell phone Handsets and Accessories Microprocessor Based Equipment Personal Digital Assistants (PDA's) and Pagers Desktops PC and Servers Notebook, Laptop, and Palmtop Computers Portable Instrumentation Peripherals MP3 Players Cordless Phones
Circuit Diagram
Schematic & PIN Configuration
SOT23-6L (Top View)
Revision 08/11/04 1 www.semtech.com
SMS05 through SMS24
PROTECTION PRODUCTS Absolute Maximum Rating
R ating Peak Pulse Power (tp = 8/20s) ESD Voltage (HBM p er IEC 61000-4-2) Lead Soldering Temp erature Op erating Temp erature Storage Temp erature Symbol Pp k VESD TL TJ TSTG Value 350 >25 260 (10 sec.) -55 to +125 -55 to +150 Units Watts kV C C C
Electrical Characteristics
SMS05 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 5V, T=25C IPP = 5A, tp = 8/20s IPP = 24A, tp = 8/20s tp = 8/20s Between I/O Pins and Ground VR = 0V, f = 1MHz 325 6 20 9.8 14.5 24 400 Conditions Minimum Typical Maximum 5 Units V V A V V A pF
SMS12 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 12V, T=25C IPP = 5A, tp = 8/20s IPP = 15A, tp = 8/20s tp = 8/20s Between I/O Pins and Ground VR = 0V, f = 1MHz 135 13.3 1 19 23 15 150 Conditions Minimum Typical Maximum 12 Units V V A V V A pF
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SMS05 through SMS24
PROTECTION PRODUCTS Electrical Characteristics (Continued)
SMS15 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 15V, T=25C IPP = 5A, tp = 8/20s IPP = 12A, tp = 8/20s tp = 8/20s Between I/O Pins and Ground VR = 0V, f = 1MHz 100 16.7 1 24 29 12 125 Conditions Minimum Typical Maximum 15 Units V V A V V A pF
SMS24 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 24V, T=25C IPP = 5A, tp = 8/20s IPP = 8A, tp = 8/20s tp = 8/20s Between I/O Pins and Ground VR = 0V, f = 1MHz 60 26.7 1 40 44 8 75 Conditions Minimum Typical Maximum 24 Units V V A V V A pF
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SMS05 through SMS24
PROTECTION PRODUCTS Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10 Peak Pulse Power - Ppk (kW)
Power Derating Curve
110 100 90 % of Rated Power or IPP 80 70 60 50 40 30 20 10 0
1
0.1
0.01 0.1 1 10 Pulse Duration - tp (s) 100 1000
0
25
50
75
100
o
125
150
Ambient Temperature - TA ( C)
Pulse Waveform
110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 Time (s) 20 25 30 td = IPP/2 e
-t
Clamping Voltage vs. Peak Pulse Current
45 Waveform Parameters: tr = 8s td = 20s 40 Clamping Voltage - VC (V) 35 30 25 20 15 10 5 0 0 5 10 15 20 25 30 Peak Pulse Current - IPP (A) SMS05 SMS15 SMS12 SMS24 Waveform Parameters: tr = 8s td = 20s
Forward Voltage vs. Forward Current
5 4.5 Forward Voltage - VF (V) 4 3.5 3 2.5 2 1.5 1 0.5 0 0 5 10 15 20 25 30 35 40 45 Forward Current - IF (A) Waveform Parameters: tr = 8s td = 20s
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SMS05 through SMS24
PROTECTION PRODUCTS Applications Information
Device Connection for Protection of Four Data Lines The SMSxx is designed to protect up to four unidirectional data lines. The device is connected as follows: 1. Unidirectional protection of four I/O lines is achieved by connecting pins 1, 3, 4 and 6 to the data lines. Pin 2 and 5 are connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the SMSxx near the input terminals or connectors to restrict transient coupling. Minimize the path length between the SMSxx and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Protection of Four Unidirectional Lines SMSxx Circuit Diagram
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SMS05 through SMS24
PROTECTION PRODUCTS Outline Drawing - SO-8 Outline Drawing -SOT23 6L
A e1 N EI 1 ccc C 2X N/2 TIPS B 2 E D H GAGE PLANE 0.25 e DETAIL D aaa C A2 SEATING PLANE C A1 bxN bbb C A-B D A SEE DETAIL SIDE VIEW L (L1) H c
DIM
A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc
DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX
.057 .035 .000 .006 .035 .045 .051 .010 .020 .003 .009 .110 .114 .118 .060 .063 .069 .110 BSC .037 BSC .075 BSC .012 .018 .024 (.024) 6 0 10 .004 .008 .008 1.45 0.90 0.00 0.15 .90 1.15 1.30 0.25 0.50 0.08 0.22 2.80 2.90 3.00 1.50 1.60 1.75 2.80 BSC 0.95 BSC 1.90 BSC 0.30 0.45 0.60 (0.60) 6 0 10 0.10 0.20 0.20
2X E/2
01
A
A
NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
Land Pattern -SOT23 6L
X
DIM
(C) G Y Z C G P X Y Z
DIMENSIONS MILLIMETERS INCHES
(.098) .055 .037 .024 .043 .141 (2.50) 1.40 0.95 0.60 1.10 3.60
P
NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.
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SMS05 through SMS24
PROTECTION PRODUCTS Marking Codes
Part Number SMS05 SMS12 SMS15 SMS24 Marking Code 05/05 12/12 15/15 24/24
Ordering Information
Part Number SMS05.TC SMS12.TC SMS15.TC SMS24.TC SMS05.TCT SMS12.TCT SMS15.TCT SMS24.TCT Lead Finish SnPb SnPb SnPb SnPb Pb Free Pb Free Pb Free Pb Free Qty per Reel 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 R eel Size 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch
Note: (1) No suffix indicates tube pack.
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804
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